Cat6 Patch Panel (NSP-1050-24C)
Product Description
Description:
IDC: silver plated in the surface of contact conductor, copper conductor is 0.4~0.7mm, Max Connections: >200 times
Contact Resistance (excluding body resistance) ≤2.5mΩ(under normal air condition)
Insulation Resistance: ≥10000MΩ(under normal air condition)
Dielectric intensity: DC 1000V (AC 700V), no spark over and fly arc in 1 min.
RJ45 Socket: max. insertion > 750 times
Line contact pin: the thickness of gold plating (6μ, 15μ,30μ,50μ)
Color: white
Riteria: ISO/IEC11801
IDC: silver plated in the surface of contact conductor, copper conductor is 0.4~0.7mm, Max Connections: >200 times
Contact Resistance (excluding body resistance) ≤2.5mΩ(under normal air condition)
Insulation Resistance: ≥10000MΩ(under normal air condition)
Dielectric intensity: DC 1000V (AC 700V), no spark over and fly arc in 1 min.
RJ45 Socket: max. insertion > 750 times
Line contact pin: the thickness of gold plating (6μ, 15μ,30μ,50μ)
Color: white
Riteria: ISO/IEC11801
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